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Deadline: Hong Kong Fintech Global Fast Track Programme 2020


The Hong Kong FinTech Week Global Fast Track Programme is back for 2020! Got an innovative B2B FinTech solution? Looking to scale in Hong Kong and Asia?
The Hong Kong FinTech Week Global Fast Track Programme is a valuable programme specifically designed to connect your company with local corporates and investors to accelerate your growth in Hong Kong and beyond. Applications are open now.
You will gain:

  • Corporate Connection: Connect with your potential corporate clients in Hong Kong virtually or physically, including AMTDMicrosoftHong Kong Stock Exchange and more.
  • Landing Support: InvestHK will assist your business launch in Hong Kong by introducing the application of landing support from USD 111,000 up to USD 2.6 million for each eligible company.
  • Investment Commitment: a chance to win up to USD 1 million of investment commitment upon due diligence.
You are welcome to submit your solutions in any one or more of the eight verticals, including Capital Markets, WealthTech, Insurance, Payments, Commercial Banking, Retail Banking, Trade Finance and RegTech.
Applications are open now until August 31. Submit your solution and meet one-on-one with our Corporate Champions in Hong Kong and Asia.
Apply Now
Learn more about the programme at one of the upcoming HKFT20 Global Roadshows held virtually across six regions from July to August.
Register for Roadshows
If you’ve missed the previous roadshows, you can find the recorded sessions here:
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  • This event has passed.
  • Start Time
    August 31 @ 12:00 am
  • End Time
    August 31 @ 11:59 pm

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